SMT工藝分類

按焊接方式：再流焊和波峰焊

再(zai)(zai)流焊(han)工(gong)藝(yi)――先將焊(han)膏轉印(yin)到(dao)PCB板的(de)焊(han)盤上，再(zai)(zai)將片式元器件貼(tie)(tie)放在PCB板表面規定的(de)位置上，最后將貼(tie)(tie)裝好元器件的(de)PCB板放到(dao)再(zai)(zai)流焊(han)設備的(de)傳(chuan)送帶上，從爐(lu)子入(ru)口(kou)到(dao)出口(kou)（大約5-6分鐘(zhong)）完成(cheng)預熱、干燥、熔化、冷卻(que)全(quan)部焊(han)接(jie)過(guo)程(cheng)。

波峰焊(han)工藝――先(xian)將微(wei)量的貼片(pian)(pian)膠(jiao)（絕緣粘(zhan)接膠(jiao)）施加(jia)到印制板(ban)的元(yuan)(yuan)(yuan)器(qi)(qi)(qi)件(jian)底部或中(zhong)心位(wei)置上(shang)(shang)，再將片(pian)(pian)式(shi)元(yuan)(yuan)(yuan)器(qi)(qi)(qi)件(jian)貼放在印制表(biao)面規定(ding)的位(wei)置上(shang)(shang)，并進行(xing)膠(jiao)固化。片(pian)(pian)式(shi)元(yuan)(yuan)(yuan)器(qi)(qi)(qi)件(jian)被牢固地粘(zhan)接在印制板(ban)的焊(han)接面，然后(hou)插(cha)裝分立元(yuan)(yuan)(yuan)器(qi)(qi)(qi)件(jian)，最(zui)后(hou)對片(pian)(pian)式(shi)元(yuan)(yuan)(yuan)器(qi)(qi)(qi)件(jian)與插(cha)裝元(yuan)(yuan)(yuan)器(qi)(qi)(qi)件(jian)同時進行(xing)波峰焊(han)接。

二、按組裝方式：全表面組裝、單面混裝、雙面混裝